document number: mpxv6115v rev 2, 10/2012 freescale semiconductor data sheet: technical information ? 2009-2012 freescale semiconducto r, inc. all ri ghts reserved. pressure high temperature accuracy integrated silicon pressure sensor for measuring absolute pressure, on-chip signal conditioned, temperature compensated and calibrated the mpxv6115v series sensor integrat es on-chip, bipolar op amp circuitry and thin film resistor networks to prov ide a high output signal and temperature compensation. the small form factor and high reliability of on-chip integration make the freescale semiconductor, inc. pressure sensor a logical and economical choice for the system designer. the mpxv6115v series piezoresistive transducer is a state-of-the-art, monolithic, signal conditione d, silicon pressure sensor. this sensor combines advanced micromachining techniques, th in film metallization, and bipolar semiconductor processing to provide an accurate, high level analog output signal that is proportional to applied pressure. features ? improved accuracy at high temperature ? 1.5% maximum error over 0 to 85 c ? ideally suited for mi croprocessor or microcontroller-based systems ? temperature compensated from -40 to +125 c ? durable thermoplastic ( pps) surface mount package ordering information device name package options case no. # of ports pressure type device marking none single dual gauge differential absolute small outline package (mpxv6115vc6u series) mpxv6115v6u rail 482 ? vacuum/ gauge mpxv6115v mpxv6115v6t1 tape and reel 482 ? vacuum/ gauge mpxv6115v mpxv6115vc6u rail 482a ? vacuum/ gauge mpxv6115v mpxv6115vc6t1 tape and reel 482a ? vacuum/ gauge mpxv6115v small outline package mpxv6115vc6u/t1 case 482a mpxv6115v6u/t1 case 482 application examples ? vacuum pump monitoring ? brake booster monitoring mpxv6115v series -115 to 0 kpa (-16.7 to 2.2 psi) 0.2 to 4.6 v output
mpxv6115v sensors 2 freescale semiconductor pressure operating characteristics table 1. operating characteristics (v s = 5.0 vdc, t a = 25 c unless otherwise noted, p1 > p2) characteristic symbol min typ max unit pressure range p op -115 ? 0 kpa supply voltage (1) 1. device is ratiometric within this specified excitation range. v s 4.75 5.0 5.25 vdc supply current i o ? 6.0 10 madc full scale output (2) (0 to 85 c) @ v s = 5.0 volts 2. full scale output (v fso ) is defined as the output voltage at the maximum or full rated pressure. v fso 4.534 4.6 4.665 vdc full scale span (3) (0 to 85 c) @ v s = 5.0 volts 3. full scale span (v fss ) is defined as the algebraic difference between the output volt age at full rated pressure and the output voltage at the minimum rated pressure. v fss ?4 . 4?v d c accuracy (4) (0 to 85 c) 4. accuracy is the deviation in actual out put from nominal output over the entire pressure range and temperature range as a perc ent of span at 25 c due to all sources of error including the following: linearity: output deviation from a straight line relationship with pressure over the specified pressure range. temperature hysteresis: output deviation at any temperature within the operating temperature range, after the temperature is cy cled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. pressure hysteresis: output deviation at any pressure within the specified range, when this pressure is cycled to and from mini mum or maximum rated pressure at 25 c. tcspan: output deviation over the temperature range of 0 to 85 c, relative to 25 c. tcoffset: output deviation with minimum pressure applied, over the temperature range of 0 to 85 c, relative to 25 c. ??? 1.5 %v fss sensitivity v/p ? 38.26 ? mv/kpa response time (5) 5. response time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when s ubjected to a specified step change in pressure. t r ?1 . 0?m s warm-up time (6) 6. warm-up time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized. ??20?ms offset stability (7) 7. offset stability is the product's output deviation when subjected to 1000 cycles of pulsed pressure, temperature cycling with bias test. ?? 0.5 ? %v fss
mpxv6115v sensors freescale semiconductor 3 pressure maximum ratings figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. figure 1. fully integrated pressure sensor schematic table 2. maximum ratings (1) 1. exposure beyond the specified limits may c ause permanent damage or degradation to the device. rating symbol value units maximum pressure (p1 > p2) p max 400 kpa storage temperature t stg -40 to +125 c operating temperature t a -40 to +125 c output source current @ full scale output (2) 2. maximum output current is controlled by effective impedance from v out to gnd or v out to v s in the application circuit. i o +0 . 5m a d c output sink current @ minimum pressure offset (2) i o -- 0 . 5m a d c 2 sensing element gnd v out v s pins 4, 5, and 6 are no connects thin film temperature compensation and gain stage #1 gain stage #2 and ground reference shift circuitry 4 3
mpxv6115v sensors 4 freescale semiconductor pressure on-chip temperature compensation and calibration figure 2 illustrates the absolute sensing chip in the basic super small outline chip carrier (case 482a). figure 3 shows a typical application circuit (output source current operation). figure 4 shows the sensor output signal relative to pressure input. typical minimum and maximum output curves are shown for operation over 0 to 85c temperature range. the output will saturate outside of the rated pressure range. a fluorosilicone gel isolates the die surface and wire bonds from the environment, while a llowing the pressure signal to be transmitted to the silic on diaphragm. the mpxv6115v series pressure sensor operating characteristics, internal reliability and qualification tests are based on use of dry air as the pressure media. media other than dry air may have adverse effects on sensor performance and long-term reliability. contact the factory for information regarding media compatibility in your application. figure 2. cross sectional diagram sop (not to scale) figure 3. typical application circuit (output source current operation) figure 4. output vs. absolute pressure differential sensing element p2 wire bond stainless steel cap thermoplastic case die bond lead frame die fluorosilicone gel die coat p1 v s pin 2 + 5.0 v gnd pin 3 v out pin 4 mpxv6115v to adc 100 nf 51 k 47 pf transfer function: v out = v s *[(0.007652*p) + 0.92] (pressure error) v out vs. vacuum transfer function mpxv6115vc6u 5 4.5 4 3.5 3 2.5 2 1.5 1 0.5 0 output (volts) *temp factor*0.007652*v s ) v s = 5.0 v 0.25 vdc temp = 0-85 c -115 -95 -75 -55 -35 -15 0 min max
mpxv6115v sensors freescale semiconductor 5 pressure nominal transfer value: v out = v s x (0.007652 x p + 0.92) (pressure error x temp. factor x 0.007652 x v s ) v s = 5.0 0.25 vdc pressure in kpa (below atmospheric) 1.950 1.725 1.500 -1.500 -1.725 -1.950 0 -115 -100 -85 -45 -30 -15 0 pressure error (max) pressure error (kpa) temperature error band pressure error band mpxv6115v error limits for pressure 1.725 kpa -115 to 0 kpa transfer function (mpxv6115vc6u) temperature in c 4.0 3.0 2.0 0.0 1.0 -40 -20 0 20 40 60 13012010080 - 40 3 0 to 85 1 125 2 note: the temperature multiplier is a linear res ponse from 0 to -40c and from 85 to 125c. 140 temp. multiplier
mpxv6115v sensors 6 freescale semiconductor pressure surface mounting information minimum recommended footprin t for small outline package surface mount board la yout is a critical portion of the total design. the footprint for the semiconductor package must be the correct size to ensure proper solder connection interface between the board and the package. with the correct pad geometry, the packages will self-align when subjected to a solder reflow process. it is always recommended to fabricate boards with a solder mask layer to avoid bridging and/or shorting between solder pads, especially on tight tolerances and/or tight layouts. figure 5. sop footprint 0.660 16.76 0.060 typ 8x 1.52 0.100 typ 8x 2.54 0.100 typ 2.54 0.300 7.62 inch mm
mpxv6115v sensors freescale semiconductor 7 pressure package dimensions case 482-01 issue a small outline package case 482a-01 issue a small outline package dim min max min max millimeters inches a 10.54 0.425 0.415 10.79 b 10.54 0.425 0.415 10.79 c 5.38 0.230 0.212 5.84 d 0.96 0.042 0.038 1.07 g 0.100 bsc 2.54 bsc h 0.002 0.010 0.05 0.25 j 0.009 0.011 0.23 0.28 k 0.061 0.071 1.55 1.80 m 0 7 0 7 n 0.405 0.415 10.29 10.54 s 0.709 0.725 18.01 18.41 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension a and b do not include mold protrusion. 4. maximum mold protrusion 0.15 (0.006). 5. all vertical surfaces 5 typical draft. s d g 8 pl 4 5 8 1 n s b m 0.25 (0.010) a s t ?a? ?b? c m j k pin 1 identifier h seating plane ?t? dim min max min max millimeters inches a 10.54 0.425 0.415 10.79 b 10.54 0.425 0.415 10.79 c 12.70 0.520 0.500 13.21 d 0.96 0.042 0.038 1.07 g 0.100 bsc 2.54 bsc h 0.002 0.010 0.05 0.25 j 0.009 0.011 0.23 0.28 k 0.061 0.071 1.55 1.80 m 0 7 0 7 n 0.444 0.448 11.28 11.38 s 0.709 0.725 18.01 18.41 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension a and b do not include mold protrusion. 4. maximum mold protrusion 0.15 (0.006). 5. all vertical surfaces 5 typical draft. s d g 8 pl 4 5 8 1 s b m 0.25 (0.010) a s t ?a? ?b? c m j k pin 1 identifier h seating plane ?t? n v w v 0.245 0.255 6.22 6.48 w 0.115 0.125 2.92 3.17
mpxv6115v sensors 8 freescale semiconductor pressure table 3. revision number revision date description of changes 2 10/2012 ? added devices mpxb611v6u and mpx6115 v6t1 and corresponding package, 482.
document number: mpxv6115v rev. 2 10/2012 information in this document is provided solely to enable system and software implementers to use freescale products. there are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits based on the information in this document. freescale reserves the right to make changes without further notice to any products herein. freescale makes no warranty, representation, or guarantee regarding the suitability of its products for any particular purpose, nor does freescale assume any liability arising out of the app lication or use of an y product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. ?typical? parameters that may be provided in freescale data sheets and/or specifications can and do vary in differen t applications, and actual performance may vary over time. all operating parameters, including ?typicals,? must be validated for each customer application by customer?s technica l experts. freescale does not convey any license under its patent rights nor the rights of others. freescale sells products pursuant to standard terms and conditions of sale, which can be found at the following address: freescale.com/salestermsandconditions. how to reach us: home page: freescale.com web support: freescale.com/support freescale, the freescale logo, altivec, c-5, codetest, codewarrior, coldfire, c-ware, energy efficient solutions logo, kinetis, mobilegt, powerquicc, processor expert, qoriq, qorivva, starcore, symphony, and vortiqa are trademarks of freescale semiconductor, inc., reg. u.s. pat. & tm. off. airfast, beekit, beestack, coldfire+, corenet, flexis, magniv, mxc, platform in a package, qoriq qonverge, quicc engine, ready play, safeassure, smartmos , turbolink, vybrid, and xtrinsic are trademarks of freescale semiconductor, inc. all other product or service names are the property of their respective owners. ? 2012 freescale semiconductor, inc.
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